PCB & Custom Water Block Design Ree Cooll

About the project

**Project:** High-Power LED UV Module Engineering & Custom Waterblock Replication **Date:** September 20, 2026 **Methodology:** Reverse Engineering / Exact Replication & Optimization  ### 1. Project Overview The objective of this project is to reverse-engineer and accurately replicate a liquid-cooled, high-power LED illumination system. The project requires designing a **Printed Circuit Board (PCB)** featuring smart relay-based switching logic and a **3D mechanical model of a water cooling block (Waterblock)** that matches the current system's geometry, ensuring a perfect thermal fit.  ### 2. Technical Specifications of Components to Replicate ### A. Water Cooling Block (Mechanical Structure) * **Outer Length:** 50 mm * **Outer Width:** 30 mm * **Block Thickness/Height:** 20 mm * **Hydraulic Connections:** 2 top compression fittings (approx. exposed height: 30 mm). * **Mounting Points:** 4 perimeter threaded holes for fastening, with a 35.5 mm spacing between centers on the top notch. ### B. LED Module & PCB Critical Areas * **Total Internal Enclosure Housing:** 44 mm - 45 mm length x 25 mm width. * **Main LED Matrix (Maximum Heat Dissipation Area):** 22 mm length x 12 mm width. *The waterblock base must sit directly flat on top of this specific area.* * **Driver / Secondary Circuit Zone:** 7 mm to 10 mm length x 12 mm to 25 mm width, located adjacent to the LED emitter matrix. ### 3. Electronic Circuit Logic & Drivers (PCB Engineering) The routed PCB must interface with two independent constant-current LED drivers through a **Relay** and a **Filter** stage. The switching sequence must operate under the following logic:  ### Input Driver Specifications: 1. **Low-Power Driver (Small):** Model HG-RZ12W300-NF | Load: 8-12W | Output: DC 24-42V @ 300mA ±5% 2. **High-Power Driver (Large):** Model HG-RZ36W900-NF | Load: 24-36W | Output: DC 24-42V @ 900mA ±5% | PF > 0.9 | Flicker-Free ### Required Operating Modes: * **Mode 1 (Low Power):** When the relay triggers the **Small Driver (300mA)** line, the filtered current must power **ONLY the Small LED**. The Large LED matrix must remain completely off. * **Mode 2 (High Power):** When the relay switches to the **Large Driver (900mA)** line, the filtered current must power **BOTH the Large LED and the Small LED simultaneously**, safely distributing the total 900mA output across the circuit. ### 4. Scope of Work & Expected Deliverables ### Electronics Phase (Electronic Engineer): 1. Design the schematic diagram supporting the relay switching, noise filtering, and LED matrix protection. 2. Optimize the PCB layout and trace widths to handle continuous currents up to 900mA. 3. **Deliverables:** PCB project source files, manufacturing-ready **Gerber files (including Drill files)**, Bill of Materials (**BOM**) with commercial component sourcing codes, and a fully populated **3D STEP model** of the final board (critical for mechanical clearance checks). ### Mechanical Phase (3D / Industrial Designer): 1. Accurately model the 50x30x20mm waterblock based on provided photos and the PCB STEP model delivered by the electronic engineer. 2. Design internal cooling liquid channels/microchannels directly over the LED matrix contact area (22x12mm) to maximize heat transfer. 3. Incorporate appropriate sealing gaskets/O-rings to guarantee absolute water tightness and protect the electronics from leaks. 4. **Deliverables:** Final **STEP/IGES** files for CNC machining and detailed 2D technical drawings (PDF/DXF) featuring dimensions and manufacturing tolerances.

Skills required